PREPERM™ Low Loss Dielectric Thermoplastics
The PREPERM™ dielectric thermoplastics portfolio is specially formulated to meet application demands for materials that enable faster and more reliable connections at high-band 5G frequencies (mmWave).
These customizable thermoplastics provide stable and controlled dielectric performance, plus ultra-low transmission loss at mmWave frequencies up to 220 GHz. With a dielectric constant (Dk) range spanning 2.55 to 23, these materials are optimized to boost antenna efficiency and deliver lightweight solutions for 5G infrastructure and devices.
Advanced technologies to help customers produce 3D Molded Interconnect Devices (MID) for antenna productsLearn More
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|PREPERM™ Standard Grades||Telecom applications including antennas, mobile base stations and satellites, automotive and industrial radars and radomes, health and security technology such as body scanning and imaging devices.||The standard PREPERM™ grades cover a wide range of dielectric constants from 2.6 to 12.0 and can be injection molded and machined easily. These grades have very stable dielectric performance and low losses and are available in a range of colors.|
|PREPERM™ A-Series||Telecom applications including antennas, mobile base stations and satellites, automotive and industrial radars and radomes, health and security technology such as body scanning and imaging devices.||These grades offer the same performance as the standard series but with improved adhesion for metallization, coating or 2K injection molding.|
|PREPERM™ Fire Retardant Grades||Aeroplane WI-FI, telecoms, automotive||These grades cover dielectric constants from 2.65 to 12 and have a V0 or V1 UL94 rating. They offer similar advantages to the standard series - are easy to process, have good mechanical properties and thermal stability and are ROHS compliant.|
|PREPERM™ Radome Grades||Automotive and industrial radomes||Designed with excellent RF performance combined with high impact strength and moldability. They are available in black (RB) and sand (RS) colors.|
|PREPERM™ High Permittivity Series||H-series uses a different filler but is based on the same technology as the standard series. They provide very high permittivity up to 23.|
|PRERERM™ PEEK High Temperature Grades||Aviation, structural parts and applications looking to replace ceramics||These high temperature grades have low dissipation factor, outstanding thermal stability, excellent mechanical properties, and chemical resistance and inherent flame retardancy.|
|PREPERM™ LCP High Temperature Grades||Thin parts like mobile communication||These high temperature grades have low dissipation factor, outstanding thermal stability, excellent mechanical properties, and chemical resistance and inherent flame retardancy and high flowability for thin parts.|
|PREPERM™ Flexible Grades||Films, sheet, filaments||These materials have high elongation at break. They are typically used in films, sheet, filaments or applications that need extensive bending.|
|4G/5G Antenna Base Stations||Application Snapshot||PREPERM Low Loss Dielectric Solutions provide performance and processing benefits in antenna components.||View|
|PREPERM™ Solutions for 5G||Application Bulletin||Benefits of using PREPERM solutions for 5G applications||View|
|PREPERM™ Solutions for 5G (Chinese)||Application Bulletin||Benefits of using PREPERM solutions for 5G applications (Chinese language version)||View|
|PREPERM™ Solutions for Automotive Radars - Application Bulletin||Application Bulletin||Explore PREPERM Solutions for automotive radars||View|
|PREPERM™ Solutions for Healthcare Technology - Application Bulletin||Application Bulletin||Explore PREPERM solutions for healthcare technology||View|
|PREPERM™ Solutions for Satellite Communications||Application Bulletin||Benefits of using PREPERM solutions for satellite communications applications||View|
|Radio Frequency Materials||Brochure||Maximize your radio frequency (RF) performance with PREPERM™ materials||View|
|Trendwatch™ Overcoming 5G Component Challenges (English)||eBook||A look at the trends and challenges of the 5G revolution, and next-gen materials engineered to help||View|